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Background

Electronic equipment has traditionally been air cooled for this application, this includes basic heat sink, and the method in place can comfortably deal with the current 10wH device. With increasing complexity and energy outputs on the electronics the client needs to find solutions that will deal with increased levels of heat and use minimal power. Some of these areas may also be hard to get large cooling systems into.

To replace the existing solution that uses air cooling, the client is prepared to consider alternative methods, as long as power consumption is considered and minimised, and this isn't restricted to liquid cooling methods.

Selected innovators could receive additional support from the client to take their solution to the next level of development.

Rationale:

1. Increased electronics cooling capability
2. Improved cooling efficiency with no greater costs
3. Reduced inspection and maintenance time and costs

The challenge owner is actively looking for solutions that will:

1. Cool existing equipment in a more efficient manner
2. Be future proof to enable increased cooling for more powerful electronic equipment
3. Be able to be retro fitted in the first instance, with a view to designing in once proven
4. Be able to deal with extreme temperatures and harsh environments
5. Be suitable for both a pilot/testing scenario and then to be implemented at a large number of locations

Whilst not limiting the technologies from solution providers, it is expected that solutions would consider innovations from some of the following areas:  

• Air conditioning manufacturers and solutions providers from other sectors, such as data centres, road transport and air and sea freight and passenger applications
• Air conditioning manufacturers and solutions providers with experience of fast moving and compact packaging applications, such as mobile phones
• Cooling specialists with solutions suitable for small, limited access locations
• Heat sink manufacturers with additional cooling with limited weight or space requirements
• New materials tested, as well as systems that may run coolant through micro bores
• Circuit board manufacturers that have designed advanced cooling systems
• Gas specialists
• Evaporation techniques
• Refrigerated gas systems

The challenge owner will not consider solutions that involve: 

• Anything that cannot be operated in extreme temperatures and harsh locations
• Large energy consumption units
• Large space requirements
• Large volumes of additional weight
  

Rewards and benefits

Successful applicants will be given an opportunity to pitch to the Challenger. The package may also include:

• Support from the Catapult networks and the KTN
• Support in the development of a prototype or pilot 
• Technical support
• Invitation to attend or present at KTN or Catapult events
• A potential business collaboration
• Investor introductions (if investment is required)
• Support if any innovate or similar competitions are relevant.

Functional requirements

• A future proof efficient cooling method as energy requirements increase
• An alternative and robust solution for a harsh environment
• Robust enough to be operated for long periods of time with minimal maintenance
• Provide a solution in a small and lightweight package
• Still allow change out of failed boards in minimal time

Technical Characteristics

• Must initially be suitable for retrofit to a wide variety of locations, with potential to be included at the design stage for the right solutions in the future
• To provide instant cooling with minimal start up or shut down lag

Operating Conditions

• Harsh environment (-10 to + 30 Degrees)
• Electronics cooling in a small, hard to access location
• Minimal access for long periods

Deployment Timescale

• Launch of the Competition: 3rd of September 2019
• Deadline for applications: 18th of October 2019
• Selection and notification of finalists: 25th October 2019
• Solutions should be:
• Deployable on a pilot/test basis within 6 months
• Then deployable as part of a structured upgrade plan over the next 5 years for the compact cooling solution
• The condenser cooling alternative is required ASAP

Cost requirement and market opportunity

• Costs will be proportional to deployability
• For the right product, the solution could be used across the clients portfolio and wider
• This challenge offers a multi year development opportunity for the right solution

Eligibility and assessment criteria

Entrants to this competition must be:

• Established businesses, startups, SMEs or individual entrepreneurs
• UK based or have the intention to set up a UK base

Applications will be assessed on:

• Established businesses, startups, SMEs or individual entrepreneurs
• UK based or have the intention to set up a UK base
• Relevance to the topic
• Innovative nature of the subject
• Coherence of the proposed business model
• Feasibility/ economic viability
• Development potential
• Maturity of project/solution
• Ability to launch project quickly/Ease of implementation
• Price/quality ratio
• Suitability for the UK and European Market

IP and Potential Commercial Route

• Existing background IP associated with a potential solution will remain with Solution Provider(s). Where any new IP generation is envisaged, it will be subject to the mutual IP agreement of the Solution Provider(s) and Innovation Challenger.
• Any commercial deployment of transferred solution or newly developed solution, through licensing, joint venture, partnership or direct investment, will be subject to the commercial agreement between the Solution Provider(s) and Innovation Challenger.
• Where necessary, a non-disclosure agreement (NDA) may be signed to uphold confidentiality in the engagement between the Solution Provider(s) and Innovation Challenger. (This would be expected to be after company selection, it is suggested that details of IP not be disclosed, focus on the outcomes of the technology proposed).
• Innovate UK and KTN do not take any share of IP ownership or enter into commercial venture through the iX programme.